TitleProduct

FZ Silicon Wafer

  • Price:

    Negotiable

  • minimum:

  • Total supply:

  • Delivery term:

    The date of payment from buyers deliver within days

  • seat:

    Zhejiang

  • Validity to:

    Long-term effective

  • Last update:

    2024-01-16 22:54

  • Browse the number:

    87

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Company Profile

Ningbo Sibranch Microelectronics Technology Co.,Ltd.

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Contact:saibang888(Mr.)  

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Telephone:

Phone:

Area:Zhejiang

Address:Zhejiang

Website:http://www.sibranchwafer.com/ http://saibang888.pomas.net/

Product Details

Product Description

 

FZ Silicon Wafer is a high-quality product that is made using the Float Zone (FZ) method. This method involves melting a single crystal of silicon and then pulling it up from the melt at a slow and controlled rate. This results in a pure and defect-free semiconductor material with excellent electrical properties.

 

The FZ Silicon Wafer is widely used in the semiconductor industry for various applications, such as in the production of integrated circuits, solar cells, sensors, and more. The wafer's high purity and low defect density make it ideal for high-performance electronic devices that require accurate and reliable performance.

 

FZ Silicon Wafer also boasts excellent material uniformity and surface finish, which further enhances its performance and reliability. The wafer is available in various diameters and thicknesses to suit different applications and requirements.

 

Overall, FZ Silicon Wafer is an essential component in the manufacturing of high-quality electronic devices. Its exceptional properties contribute to better performance, efficiency, and reliability, making it an indispensable material for the semiconductor industry.

 

Growth

CZ, MCZ, FZ

Grade

Prime, Test, Dummy, etc.

Diameter

Other diameters, such as 10mm, 12.7mm, 1.5″, 35mm, 40mm, 2.5″ are also possible

Thickness

50~3000um

Finish

As cut, lapped, etched, SSP, DSP, etc

Orientation

(100) (111) (110) (211) (311) (511) (531) etc.

Off cut

Up to 4 deg

Type/Dopant

P/B, N/Phos, N/As, N/Sb, Intrinsic

Resistivity

FZ: Up to 20k ohm-cm

CZ/MCZ: From 0.001 to 150 ohm-cm

Thin films

* PVD: Al, Cu, Au, Cr, Si, Ni, Fe, Mo, etc.

* PECVD: Oxide, Nitride, SiC, etc.

* Silicon epitaxial wafers and epitaxial services (SOS, GaN, GOI etc).

Processes

DSP, ultra thin, ultra flat, etc.

Downsizing, back grinding, dicing, etc.

MEMS

 

Product Picture

http://www.sibranchwafer.com/